Suzhou Zhen Kun Technology Limited provides IC packaging testing services in the process of semiconductor manufacturing. The product line covers many fields such as Memory, Logic, Power, RF. Complete solutions with small size, light weight, and price advantage, the company vigorously develops high -density packaging technical capabilities to provide customers with strong guarantee for customers to increase market opportunities and enhance competitiveness.
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BGA
Ball Grid Array (BGA): A high-density surface mount packaging form in which an array of solder balls is made on the back of the packaging substrate to interconnect with a printed circuit board (PCB).
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LGA
Land Grid Array (LGA): A packaging form based on a substrate, with one or more metal contacts (pins) arranged in a matrix.
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QFN/DFN
Quad Flat Non leads (QFN) or Dual Flat Non leads (DFN): They have a square or rectangular appearance and are based on a copper frame. The central area of the package body uses large exposed solder pads for heat conduction, and electrical connections are made around or on both sides.
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SOP
Small Outline Package (SOP): A small-sized package with seagull shaped (L-shaped) pins leading out from both sides of the package.
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