ZKT can provide two ways: Wire Bond and FLIP Chip to realize the chip and substrate electrical connection. Compared with traditional packaging technology, BGA packaging has better heat dissipation performance and electrical properties, higher I/O density and smaller volume, and the stress caused by the differences in thermal expansion coefficient is small, which improves the stability of the device. And reliability.

The Internet of Things/smart home, mobile terminal, vehicle electronics and other fields.

The product size covers 5X5 ~ 16X16mm, and the number of lines exceeds 750;

Package The total thickness from 0.8mm ~ 1.6mm;

You can provide golden line/silver alloy line/plated copper thread multi -dimensional line diameter;

Fine Pitch (BPP/BPO: 45/39.6um)；

Provide Wire Bond & amp; Flip Chip packaging technology;

Multi -layer stack structure design, up to 16 layers.

Among the storage BGA series products, EMMC (Embedded Multi Media Card, Embedded Multimedia Storage Card) and EUFS (EMBEDDED Universal Flash Storage) are important storage devices of current mobile devices. They have high storage capacity and access to each Fast and other characteristics.
ZKT has more than ten years in the market, with EMMC and EUFS mature assembly and testing solutions.